Product Description

M.G. Chemicals no clean Lead-Free Solder was designed with 96.3 percent tin, 0.7 percent copper and 3 percent silver alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder. M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0 percent. A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0. Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications. Ag content: 2.8-3.2 percent . Cu content: 0.3-0.7 percent . Sn content: Balance. Flux classification: ORL0. Copper mirror: no removal of copper film. Silver chromate: pass. Corrosion: pass. SIR JSTD-004,Pattern down: 2.33 x 10 11 ohms. SIR Bellcore (Telecordia): 6.12 x 10 11 ohms. Electromigration: pass. Post reflow flux residue: 55 percent . Acid value: 190-210. Flux residue dryness: pass. Spitting of flux-cored solder: 0.30 percent . Solder spread : 130 mm2. Melting point: 217-221 degree C (422.6 - 429.8 degree F). Upper temperature limit: do not to exceed 350 degree C (tip temperature). Wire diameter: 0.032" (0.81 mm). Standard wire gauge: 21. Tolerance: +/- 0.002". Hardness, brinell: 15HB. Coefficient of thermal expansion: pure Sn=23.5. Tensile strength: 4312 psi. Density: 7.39 g/cc.